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eMCP IC

Type

Ball

Size

Capacity

Brand

eMCP

BGA221

11.5X13mm

8G+8G
16G+8G

Hynix
Micron
Spectek

eMCP

BGA254

11.5X13mm
11.3X15mm

4G+4G
8G+8G
8G+4G

Hynix
Samsung
Spectek

ePOP

BGA144

8X9.5mm

4G+4G
8G+8G

Hynix
Samsung
Spectek

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TEL : 

+886-2-8227-8586

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FAX : 

+886-2-8227-8587

Address  : 

8F-5, No. 716, Zhongzheng Rd., Zhonghe Dist., New Taipei City 235, Taiwan

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悅群電子股份有限公司
Hotop Technologies, Inc

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